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INTEGRATED CIRCUITS
DATA SHEET
PCF84C12A 8-bit microcontroller
Product specification Supersedes data of 1996 Nov 20 File under Integrated Circuits, IC14 1998 May 11
Philips Semiconductors
Product specification
8-bit microcontroller
CONTENTS 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 13.1 13.2 13.3 14 15 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION (see note 1) BLOCK DIAGRAM PINNING INFORMATION Pinning Pin description INSTRUCTION SET ROM MASK OPTIONS HANDLING LIMITING VALUES DC CHARACTERISTICS AC CHARACTERISTICS PACKAGE OUTLINES SOLDERING Introduction DIP SO DEFINITIONS LIFE SUPPORT APPLICATIONS
PCF84C12A
1998 May 11
2
Philips Semiconductors
Product specification
8-bit microcontroller
1 FEATURES 2 GENERAL DESCRIPTION
PCF84C12A
* Manufactured in silicon gate CMOS process * 8-bit CPU, ROM, RAM, I/O in a 20-lead package * 1 kbyte ROM * 64 byte RAM * Over 100 instructions (based on MAB8048) all of 1 or 2 cycles * 13 quasi-bidirectional I/O port lines * 8-bit programmable timer/event counter 1 * Two single-level vectored interrupts: - external - 8-bit programmable timer/event counter 1 * Two test inputs, one of which also serves as the external interrupt input * Stop and Idle modes * Supply voltage: 2.5 to 5.5 V * Clock frequency: 1 to 16 MHz * Operating temperature: -40 to +85 C. 3 ORDERING INFORMATION TYPE NUMBER(1) NAME PCF84C12AP PCF84C12AT Note DIP20 SO20
This data sheet details the specific properties of the PCF84C12A. The shared properties of the PCF84CxxxA family of microcontrollers are described in the "PCF84CxxxA family" data sheet, which should be read in conjunction with this publication. Note that the devices described in this data sheet do not feature I2C-bus compatibility or derivative logic, so the information given in the family data sheet about these features can be ignored. The PCF84C12A is a general purpose CMOS microcontroller with 1 kbyte of program memory. It includes 64 bytes of RAM and 13 I/O port lines. The instruction set is based on the MAB8048 and is a sub-set of that listed in the "PCF84CxxxA family" data sheet.
PACKAGE DESCRIPTION plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm VERSION SOT146-1 SOT163-1
1. Please refer to the Order Entry Form (OEF) for these devices for the full type number to use when ordering. This type number will also specify the required program and ROM mask options.
1998 May 11
3
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INTERNAL CLOCK FREQ. 30 32 TIMER/ EVENT COUNTER TEST 1 5 8
4
Philips Semiconductors
8-bit microcontroller
BLOCK DIAGRAM
P1.0 to P1.4 3 PORT 1 BUFFER PORT 1 FLIP-FLOPS RESIDENT ROM 1 kbyte (PCF84C12A) 2 kbytes (PCF84C22A) 4 kbytes (PCF84C42A) DECODE
P0.7 to P0.0
PORT 0 BUFFER PORT 0 FLIP-FLOPS
MEMORY BANK FLIP-FLOPS
HIGHER PROGRAM COUNTER
LOWER PROGRAM COUNTER
PROGRAM STATUS WORD
5
8
8
8
8
8
8
8
8
8 MULTIPLEXER REGISTER 0 REGISTER 1 REGISTER 2 REGISTER 3 REGISTER 4 REGISTER 5 REGISTER 6 REGISTER 7 8 LEVEL STACK (VARIABLE LENGTH) OPTIONAL SECOND REGISTER BANK
INT / T0 INTERRUPT
RESET INITIALIZE
XTAL 1
XTAL 2
handbook, full pagewidth
4
INTERRUPT LOGIC ACCUMULATOR TEMPORARY REGISTER 1 TEMPORARY REGISTER 2 RAM ADDRESS REGISTER timer interrupt ARITHMETIC LOGIC UNIT INSTRUCTION REGISTER & DECODER INT / T0 (8) external interrupt DECIMAL ADJUST STOP IDLE CONDITIONAL BRANCH LOGIC TEST 1 TIMER FLAG CARRY ACC ACC BIT TEST RESIDENT RAM ARRAY 64 bytes
MBC951
D E C O D E
DATA STORE
PCF84C12A
Product specification
CONTROL & TIMING
OSCILLATOR
Fig.1 Block diagram of PCF84C12A.
Philips Semiconductors
Product specification
8-bit microcontroller
5 5.1 PINNING INFORMATION Pinning 5.2 Pin description
PCF84C12A
Table 1
DIP20 and SO20 packages PIN 1 to 8 TYPE I/O DESCRIPTION Port 0: 8-bit quasi-bidirectional I/O port Interrupt/Test 0 ground Test 1/count input of 8-bit timer/event counter 1 crystal oscillator input or external clock input crystal oscillator output reset input Port 1: 4-bit quasi-bidirectional I/O port positive supply
SYMBOL
handbook, halfpage
P0.0 P0.1 P0.2 P0.3 P0.4 P0.5 P0.6 P0.7 INT/T0
1 2 3 4 5
20 V DD 19 18 17 16 P1.4 P1.3 P1.2 P1.1 P1.0 RESET XTAL2 XTAL1 T1
P0.0 to P0.7
INT/T0 VSS T1
9 10 11
I P I
PCF84C12A
6 7 8 9 15 14 13 12 11
MBK778
XTAL1
12
I
XTAL2 RESET P1.0 to P1.4
13 14 15 to 19
O I I/O
VSS 10
Fig.2 Pin configuration. VDD 6 INSTRUCTION SET 20 P
Since the I2C-bus interface, Port 2 and derivative logic are not provided, instructions associated with these functions are not available. ROM space is restricted to 1 kbyte for the PCF84C12A. Therefore, the instructions SEL MB1/2/3 should be avoided as they would define non-existing program memory banks. As RAM space is limited to 64 bytes, care should be taken to avoid accesses to non-existing RAM locations. Refer to the "PCF84CxxxA family" data sheet, for a complete description of the instruction set.
1998 May 11
5
Philips Semiconductors
Product specification
8-bit microcontroller
7 ROM MASK OPTIONS ROM CODE Program/data Port Output P0.0 to P0.7 P1.0 to P1.4 Port State after reset P0.0 to P0.7 P1.0 to P1.4 Oscillator Transconductance 8 HANDLING LOW (gmL) MEDIUM (gmM) set set reset reset standard standard open-drain open-drain OPTION
PCF84C12A
Any mix of instructions and data up to ROM size of 1 kbyte.
push-pull push-pull - -
HIGH (gmH)
Inputs and outputs are protected against electrostatic discharge in normal handling. However, it is good practice to take normal precautions appropriate to handling MOS devices. See "Data Handbook IC14, Section: Handling MOS devices". 9 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI II IO Ptot PO IDD ISS Tstg Tj supply voltage all input voltages DC input current DC output current (except Port 1); output LOW total power dissipation power dissipation per output supply current ground supply current storage temperature range operating junction temperature PARAMETER MIN. -0.5 -0.5 -10 -10 - - -50 -100 -55 - +7 VDD + 0.5 +10 +10 125 30 +50 +50 +150 90 MAX. V V mA mA mW mW mA mA C C UNIT
1998 May 11
6
Philips Semiconductors
Product specification
8-bit microcontroller
PCF84C12A
10 DC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL VDD IDD PARAMETER operating supply voltage operating supply current see Fig.3 note 1; see Figs 4 and 5 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(idle) supply current (Idle mode) note 1; see Figs 6 and 7 VDD = 3 V; fxtal = 3.58 MHz (gmL) VDD = 5 V; fxtal = 10 MHz (gmL) VDD = 5 V; fxtal = 16 MHz (gmM) VDD = 5 V; fxtal = 16 MHz (gmH) IDD(stp) Inputs VIL VIH ILI Outputs IOL IOH IOH1 LOW-level output sink current HIGH-level pull-up output source current HIGH-level push-pull output source current VDD = 5 V; VO = 0.4 V; see Fig.9 VDD = 5 V; VO = 3.5 V; see Fig.10 VDD = 5 V; VO = 0 V; see Fig.10 VDD = 5 V; VO = 4.6 V; see Fig.11 1.6 40 - -1.6 12 100 -140 -7 - - -400 - mA A A mA LOW-level input voltage HIGH-level input voltage input leakage VSS VI VDD 0 0.7VD
D
CONDITIONS
MIN. 2.5 - - - - - - - - -
TYP. - 0.3 1.1 1.7 2.5 0.2 0.8 1.2 1.7 1.2 - - -
MAX. 5.5 0.6 3.0 5.0 6.0 0.4 1.6 4.0 5.0 10
UNIT V mA mA mA mA mA mA mA mA A V V A
supply current (Stop mode)
VDD = 2.5 V; notes 1 and 2; see Fig.8
0.3VD
D
VDD +1
-1
Oscillator (see Fig.12) gmL gmM gmH RF LOW transconductance MEDIUM transconductance HIGH transconductance feedback resistor VDD = 5 V VDD = 5 V VDD = 5 V 0.2 0.9 3.0 0.3 0.4 1.6 4.5 1.0 1.0 3.2 9.0 3.0 mS mS mS M
Notes 1. VIL = VSS; VIH = VDD; open drain outputs connected to VSS; all other outputs, including XTAL2, open (typical values at 25 C with crystal connected between XTAL1 and XTAL2). 2. VIL = VSS; VIH = VDD; RESET and T1 at VSS; INT/T0 at VDD; crystal connected between XTAL1 and XTAL2; open drain outputs connected to VSS; all other outputs open.
1998 May 11
7
Philips Semiconductors
Product specification
8-bit microcontroller
PCF84C12A
MBC953 - 1
handbook, halfpage
18
3 I DD (mA)
MBC955
f xtal (MHz) 12
2 16 MHz
10 MHz 6 guaranteed operating range 1 3.58 MHz
0 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
Supply current based on optimal oscillator selection.
Fig.3
Maximum clock frequency as a function of operating supply voltage (VDD).
Fig.4
Typical operating supply current (IDD) as a function of operating supply voltage (VDD).
3 I DD (mA) 2 5V
MBC956
handbook, halfpage
3
MBC957
IDD(idle) (mA) 2
16 MHz 1 3V 1 10 MHz 3.58 MHz
0 0.1
0 1 10 fxtal(MHz) 100 1 3 5 V DD (V) 7
Supply current based on optimal oscillator selection. Supply current based on optimal oscillator selection.
Fig.6 Fig.5 Typical operating supply current (IDD) as a function of clock frequency (fxtal).
Typical supply current in Idle mode (IDD(idle)) as a function of operating supply voltage (VDD).
1998 May 11
8
Philips Semiconductors
Product specification
8-bit microcontroller
PCF84C12A
handbook, halfpage
3
MBC958
MBC954
handbook, halfpage
3
IDD(idle) (mA) 2
IDD(stp) (A) 2
85 C 1 5V 1 25 C
o
o
3V 0 0.1 0 1 3 5 V DD (V) 7
1
10 fxtal(MHz)
100
Supply current based on optimal oscillator selection.
Fig.8 Fig.7 Typical supply current in Idle mode (IDD(idle)) as a function of clock frequency (fxtal).
Typical supply current in Stop mode (IDD(stp)) as a function of operating supply voltage (VDD).
16 I OL (mA) 12
MBC959
300 I OH (A) 200
MBC960
VO = VSS
8
100
VO = 0.7 V DD
4 1 3 5 V DD (V) 7
0 1 3 5 V DD (V) 7
VO = 0.4 V.
Fig.9
Typical LOW level output sink current (IOL) as a function of operating supply voltage (VDD).
Fig.10 Typical HIGH level pull-up output source current (IOH) as a function of operating supply voltage (VDD).
1998 May 11
9
Philips Semiconductors
Product specification
8-bit microcontroller
PCF84C12A
handbook, halfpage
12
MBC961
handbook, halfpage
6
MBC962
I OH1 (mA) 8
gm (mS) 4
g mH
4
2
g mM
g mL 0 1 3 5 V DD (V) 7 0 1 3 5 V DD (V) 7
VO = VDD - 0.4 V.
Fig.11 Typical HIGH-level push-pull output source current (IOH1) as a function of operating supply voltage (VDD).
Fig.12 Typical transconductance values (gm) as a function of operating supply voltage (VDD) for the options gvmL, gmM and gmH.
11 AC CHARACTERISTICS VDD = 2.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; all voltages with respect to VSS; unless otherwise specified. SYMBOL tr tf fxtal PARAMETER rise time all outputs fall time all outputs clock frequency CONDITIONS VDD = 5 V; Tamb = 25 C; CL = 50 pF VDD = 5 V; Tamb = 25 C; CL = 50 pF see Fig.3 MIN. - - 1 TYP. 30 30 - MAX. - - 16 UNIT ns ns MHz
1998 May 11
10
Philips Semiconductors
Product specification
8-bit microcontroller
12 PACKAGE OUTLINES DIP20: plastic dual in-line package; 20 leads (300 mil)
PCF84C12A
SOT146-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 20 11 MH wM (e 1)
pin 1 index E
1
10
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 c 0.36 0.23 0.014 0.009 D
(1)
E
(1)
e 2.54 0.10
e1 7.62 0.30
L 3.60 3.05 0.14 0.12
ME 8.25 7.80 0.32 0.31
MH 10.0 8.3 0.39 0.33
w 0.254 0.01
Z (1) max. 2.0 0.078
26.92 26.54 1.060 1.045
6.40 6.22 0.25 0.24
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT146-1 REFERENCES IEC JEDEC EIAJ SC603 EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-05-24
1998 May 11
11
Philips Semiconductors
Product specification
8-bit microcontroller
PCF84C12A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1998 May 11
12
Philips Semiconductors
Product specification
8-bit microcontroller
13 SOLDERING 13.1 Introduction
PCF84C12A
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. 13.3.2 WAVE SOLDERING
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (order code 9398 652 90011). 13.2 13.2.1 DIP SOLDERING BY DIPPING OR BY WAVE
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.3.3 REPAIRING SOLDERED JOINTS
The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.2.2 REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 13.3 13.3.1 SO REFLOW SOLDERING
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
1998 May 11
13
Philips Semiconductors
Product specification
8-bit microcontroller
14 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF84C12A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 May 11
14
Philips Semiconductors
Product specification
8-bit microcontroller
NOTES
PCF84C12A
1998 May 11
15
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
455102/1200/05/pp16
Date of release: 1998 May 11
Document order number:
9397 750 03606

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